FTS offer FEA based Thermal and Structural analysis for either design guided mitigation efforts as well as confidence that the design will meet acceptance testing criteria. Proper thermal design is important as electrical performance may change over temperature. Additionally, increased temperatures can significantly reduce the lifetime and reliability of the module. Thermal cases and examples include:
- Steady State and Transient thermal studies
- Natural and Forced Convection Boundary Conditions
- Fluid Flow Studies (CFD) and Fan Selection
- Heat Pipes, Thermal Vias and other Cooling Techniques
- Worst Case Die Junction Temperatures and MTBF Report
- Thermal Shock and Thermal Cycling (-55C to 125C)
- Burn-in Temperature recommendations
Structural Analysis FEA simulation results can help guide the design into passing or prompt design changes so that the module will be expected to survive and pass environmental specifications.
A few examples of Structural Analysis would include:
- Dynamic Analysis (Random Vibration, etc..)
- Fatigue Life Estimation
- Octave Rule and Modal Analysis (PCB Bolt Pattern)
- Mechanical Shock (1/2 Sine and Sawtooth Waveforms)
